2d x ray
X-ray inspection systems are essential to optimize yields, ensure quality control standards, and perform failure analysis of many tools including PCB’s and semiconductors/ Indeed, x-ray inspection systems may in many cases are the only way to inspect electronic components in a non-destructive techniques manner. Over the past few years significant improvement have occurred in the 2D x-ray techniques.
Specifically, an alternative now exists to absorption contrast (otherwise known as x-ray imaging). This this technique is powerful, make no mistake. Still, it does not make use of every last bit of information the x-ray beam contains. As an alternative and supplement to absorption contrast, it is now possible to resolve beam energy changes, enabling the decoupling of thickness from density effects, and hence the determination of both. This quantitative information can then be analyzed to achieve new levels of insight, potentially opening the door to another revolution of X-ray inspection assays.
This technology is known as a multi absorption plate (MAP) which can be placed in the beam path. Machine learning algorithms, can then be used to determine material type and thickness.
Quantitative composition and thickness information can be leveraged used to provide detailed PCD diagnostics and semiconductor inspections. Possible applications include thickness measurements, solder type analysis, and quality standards conformance. Of course, these results can always validated via a 3D CT scan. A 3D CT scan, you say? This is a technique uses reconstruction algorithms to create a 3D model out of hundreds of images captured from different angles.
To hear more about the exciting new applications opened up by advances in the 2D X ray technique, and you options for implementing them in your own setting, contact Merkel today!
